PCB Assembly & Testing
         

 
   MICRO ASSEMBLY  
   ADVANCED REWORK  
   FINEPLACER® core  
   FINEPLACER® coreplus  
   FINEPLACER® jumbo rs  
   FINEPLACER® pico rs  
   FINEPLACER® micro rs  
   FINEPLACER® micro hvr  
   FINEPLACER® matrix rs  
   Related Equipment  
   Product Videos  


 
 
 

FINEPLACER® matrix rs
Future in Advanced Rework

The FINEPLACER® matrix rs is a semi-automatic rework station representing the latest development from Finetech, encompassing the “Built to be Best” philosophy.

With a high level of process modularity, the system supports the complete rework cycle in a platform ergonomically designed to provide a state-of-the-art technical solution, low maintenance and easy service access.

Open application architecture ensures compatibility with future technologies as users transition from R&D into OEM production.

     Highlights
 
  • Industry-leading thermal management
  • Components from 0.125 mm x 0.125 mm to 100 mm x 100 mm*
  • Board sizes up to 460 mm x 390 mm*
  • Automated top heater calibration
  • Closed loop force control
  • Real time contrast optimization with LED lighting
  • Fast conversion from rework station to die bonder
  • Ergonomic and intuitive design reduces user fatigue
  • Placement accuracy better than 10 µm

    • FINEPLACER® matrix rs

    		   

      Features     Benefits  
     
  • Automated processes
  • Vision alignment system with fixed beam splitter
  • Integrated Process Management (IPM)
  • Real time process observation camera
  • Adaptive process library
  • Process transfer from system to system
    		•     
  • Hands-off component placement, user independent process operation
  • Outstanding placement accuracy and instant operation without adjustments
  • Synchronized control of all process related parameters: force, temperature, time, flow, power, process environment and illumination
  • Immediate visual feedback reduces process development time
  • Fast and easy process development
  • Identical results on different machines allow central profile development, administration and distribution

    		•   

      Processes     Applications  
     
  • Component removal
  • Site cleaning
  • Re-balling (array, single)
  • Paste printing (component, PCB)
  • Paste dipping
  • Paste dispensing
  • Fluxing
  • Soldering
  • Desoldering
    		•    
  • Soldering of:
    •    - BGA, µBGA/CSP, QFN, DFN, PoP, QFP, PGA, SON
       - Small passives down to 01005
       - RF shields, RF frames
       - Connectors, sockets
       - Sub assemblies, daughter boards
       - Flipchip (C4)
  • Pin in Paste (PiP)
  • Through Hole Reflow (THR)
  • Reworkable underfill, conformal coating
  • Single ball rework
  • Micro assembly applications

    		•   

      Technical SpecificationsApplications  
         Placement accuracy*: 10 µm  
         Field of view (min)1: 3.5 mm x 2.6 mm  
         Field of view (max)1: 43 mm x 32 mm  
         Component size (min)1: 0.125 mm x 0.125 mm  
         Component size (max)1: 100 mm x 100 mm  
         Theta fine travel ± 2°  
         Thermocouples*: 8  
           
         Top Heating2:  
         Power: 900 W  
         Temperature ramp rate: 1 K/s - 50 K/s  
         Flow range: 10 Nl/min - 70 Nl/min  
         Board Heating2:  
         Power: 4200 W (12 zones)  
         Heated area (max): 450 mm x 300 mm  
         Flow range: 192 Nl/min  
       

      Modules & Options  
     
  • Board Printing Tools
  • Component Presentation
  • Dispenser Module
  • Process Gas Switching
  • Process Video Module
  • Solder Removal Module
  • HOTBEAM
    		•
  • Bottom Heating Module
  • Direct Component Printing Module (DCP)
  • Flux Transfer Module
  • Process Start Sensor
  • Reballing Module
  • Top Heating Module
  • MiniOven 04
    		•   
           

    * depending on configuration/application
    1 standard value, other values on request
    2 optional module


    For more information please contact :- 
    primegroup@vsnl.com


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